Principle of UV Laser Marking Machine

The UV laser marking machine is developed using a 355nm ultraviolet laser. This machine employs third-harmonic generation technology within the cavity. Compared to infrared lasers, the 355nm UV laser has a very small spot size. The marking effect is achieved by directly breaking the molecular chains of the material with short-wavelength laser light, significantly reducing mechanical deformation of the material. Thermal deformation is minimized (as it is a cold light source), making it primarily suitable for ultra-fine marking and engraving. It is particularly well-suited for applications such as marking on food and pharmaceutical packaging materials, micro-drilling, high-speed dicing of glass materials, and complex pattern cutting on silicon wafers.

Applicable Materials
Mainly used in high-end markets for ultra-fine processing, such as marking on the surfaces of packaging bottles for pharmaceuticals, cosmetics, food, and other polymer materials. The results are extremely precise, with markings that are more durable and cleaner than inkjet coding and free from pollution. It is also used for marking and dicing flexible PCBs, micro-drilling and blind hole processing on silicon wafers, QR code marking on LCD glass, drilling on glassware surfaces, marking on metal surface coatings like ABS, plastic keys, electronic components, gifts, communication devices, building materials, and more.