EPO-TEK?353ND is a two-component high-temperature epoxy resin designed for semiconductor, hybrid, optical fiber, and medical applications. It is one of the most popular products in the EPO-TEK? brand and is renowned worldwide for its performance and reliability. It is also available in single-component frozen syringes.

Performance Introduction:

● Reasonable pot life, allowing for low-temperature curing. Turns amber after curing.
● Meets NASA low outgassing standard ASTM E595 with proper curing
● Recommended semiconductor applications: Wafer bonding for CSP; manufacturing of MEMs devices; flip chip underfill.
● Recommended hybrid applications: Provides near-hermetic and UHV seals in sensor devices, suitable for high-temperature packaging. Fiber optic sensors resistant to >200°C field conditions with zero voiding.
● Optical fiber adhesive designed to meet remote 1221 recommended applications: Sealing optical fibers into ferrules for light transmission in the 800-1550 nm wavelength range. Optical fiber assembly packaging; optical active alignment adhesive, optical packaging environmental sealing, V-groove arrays.
● Recommended electronic assembly applications: Used as a dielectric layer in capacitor manufacturing; laminating PZT ferroelectrics found in ultrasonic or inkjet devices. Impregnating and insulating copper coil windings in motors and inductive coils. Bonding ferrite cores and magnets.