Low-pressure injection molding is an encapsulation process that involves injecting hot melt adhesive into a mold at very low injection pressure (as low as 1.5 bar) and rapidly curing it (5-50 seconds). With the sealing properties and excellent physical and chemical performance of hot melt adhesive, it achieves effects such as insulation, temperature resistance, impact resistance, shock absorption, moisture resistance, waterproofing, dust resistance, and chemical corrosion resistance. It also provides excellent protection for fragile and sensitive electronic components, even effectively encapsulating FPCs. Compared to traditional processes like potting and coating, low-pressure injection molding is not only environmentally friendly but also enhances production efficiency and helps reduce overall production costs.