Low-pressure injection molding is an encapsulation process that involves injecting hot melt adhesive at very low injection pressures (as low as 1.5 bar) into a mold, where it rapidly cures and forms (within 5-50 seconds). With the sealing properties and excellent physical and chemical performance of the hot melt adhesive, it achieves effects such as insulation, temperature resistance, impact resistance, shock absorption, moisture resistance, waterproofing, dustproofing, and chemical corrosion resistance. It also provides effective protection for fragile and sensitive electronic components, including proper encapsulation of FPCs. Compared to traditional processes like potting and coating, low-pressure injection molding is not only environmentally friendly but also enhances production efficiency and helps reduce overall manufacturing costs.