Low-pressure injection molding hot melt adhesive is primarily used in low-pressure injection molding processes. It is a malleable adhesive that undergoes physical state changes within a certain temperature range while maintaining its chemical properties, making it an environmentally friendly chemical product.

Its applications are extensive, mainly for the encapsulation and protection of precision and sensitive electronic components to achieve functions such as insulation, resistance to high and low temperatures, impact resistance, vibration damping, moisture resistance, waterproofing, dust resistance, oil resistance, and chemical corrosion resistance.

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Polyamide hot melt adhesive is a high-molecular thermoplastic polyamide resin synthesized from dimerized fatty acids. These fatty acids are derived from renewable resources such as soybeans, rapeseed, and sunflower seeds, and are then polymerized into dimers. During the polymerization process, the dimerized fatty acids react with diamines, releasing water and forming polyamide hot melt adhesive. This product is non-corrosive, odorless, exhibits strong adhesion to various substrates, and has low melt viscosity with excellent flow properties.

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Product Features: 1. Extremely low injection pressure, non-damaging to components 2. Excellent adhesion to various plastics and metals

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Product quality is guaranteed, with reasonable pricing and fast delivery times.