The JTX650 fully automatic gold removal and tinning machine is suitable for QFP/SOP/QFN/DIP packages, resistors, capacitors, and some irregular components. It addresses issues such as gold embrittlement and oxidation on the chip soldering surface, controls gold content, improves solderability, and also resolves problems like solder bridging and pin oxidation in manual tinning processes. Each chip processed by the JTX650 undergoes quality inspection via a high-definition camera, where defects such as solder bridging on chip pins and solder slag adhesion are individually screened out, achieving closed-loop quality control. The equipment automatically records data, enabling full data traceability management throughout the tinning process.

Process Flow:

Pin flux dipping----Preheating pins----Gold removal tinning in the tin pot----Pin flux dipping----Preheating pins----Tinning in the tin plating pot----Hot air drying of pins

Performance Features:

1. Utilizes X/Y/Z/U/W five-axis linkage combined with vision technology for precise control

2. Adjustable nozzle suction for different components

3. Safety grippers easily handle irregular devices and connectors, automatically locating the device center and contour

4. Process control: Tinning temperature, tinning depth, movement speed, dwell time, tinning angle

5. Closed-loop quality control

6. Tin pot low tin level alarm

7. Tin feeding low material alarm

8. Automatic soldering fume purification function