AIM REL22 is a high-reliability lead-free solder alloy introduced by AIM, featuring multiple excellent characteristics and a wide range of application fields. The following is a detailed introduction to AIM REL22:

I. Composition

The AIM REL22 lead-free solder alloy is composed of tin (Sn), bismuth (Bi), silver (Ag), copper (Cu), antimony (Sb), nickel (Ni), and trace grain refinement elements. This alloy formulation gives REL22 outstanding physical and chemical properties.

II. Main Characteristics

1. Exceptional Durability: The REL22 alloy offers better durability, making it suitable for applications involving thermal shock, vibration, and high gravitational forces.

2. Broad Process Window: Its reliability window is equivalent to that of tin/silver/bismuth/antimony/nickel/copper alloys, with a broader process window that ensures more flexible and reliable production processes.

3. Low Creep Rate: The creep rate of REL22 is lower than that of SAC alloys,

ensuring long-term stability of solder joints.

4. High Reliability/High Strength: This alloy provides high reliability and

high strength, ensuring the quality and performance of solder joints.

5. Superior Thermal Cycling Performance: REL22 performs excellently in thermal cycling tests, making it suitable for electronic products that undergo multiple temperature changes.

6. Excellent Wettability: The wettability of REL22 is better than that of low-silver/silver-free alloys,

facilitating a smooth soldering process.

III. Application Fields

Due to the excellent properties of the AIM REL22 alloy, it is highly suitable for use in harsh environments, such as automotive, aerospace, and geological exploration equipment. These fields demand extremely high reliability and durability, and the REL22 alloy is an ideal choice to meet these requirements.

IV. Product Forms

AIM REL22 can be manufactured into various product forms to meet the needs of different customers. Common product forms include solder bars (such as 1.1 kg/2.5 lb specifications), solid-core solder wires (such as diameters of

3.175 mm/0.125 inches), and no-clean solder paste (such as M8T4, 500 grams per jar). Additionally, other customized product options can be provided based on customer requirements.