I. Product Overview

AIM NC257MDSN63/PB37 86-T5 is a no-clean jet-printing solder paste manufactured by AIM Canada, specifically developed for Mycronic jet printers.

II. Product Characteristics

● Impact on equipment: Extends the lifespan of equipment components and reduces solder waste and consumption.

● Soldering performance: Offers excellent wetting properties, resulting in smooth and shiny solder joints while reducing voids in BGA (Ball Grid Array) and BTC (Board-Level Chip) devices.

● AIM NC257MD post-solder residue: Under the relatively high temperature conditions required for lead-free alloys, it still maintains very low post-solder residue. The residue is transparent and easily pierced by needles. Some residue remains on components after reflow but does not require cleaning. If cleaning is necessary, AIM has collaborated with industry partners to ensure that NC257MD residues can be cleaned with standard flux residue cleaners.

III. Handling and Storage

● Temperature recovery requirements: Before opening the sealed solder paste for use, allow it to fully and naturally recover to room temperature. Recovery from -18°C (0°F) takes approximately 12 hours, while recovery from 0°C to 12°C (32°F - 55°F) takes about 4 hours.

● Shelf life: After opening, the shelf life of the solder paste depends on the environment and application. Replacing the syringe solder paste daily can extend the life of the jet printhead and ensure optimal performance. Alloy composition and storage conditions may affect shelf life. For specific product information, refer to the AIM NC257MD Certificate of Analysis. For more details, see the AIM Solder Paste Usage Guide.