1. AIM M8 Solder Paste Characteristics

Low Voiding Defects: <5% on BGA, <10% on BTC Components; Excellent Print Transfer Rate <0.5 AR; Eliminates Pillow Defects; Compliant with REACH and RoHS*-Halogen-Free; Designed for T4 and Finer Powder; Strong Wettability Suitable for Lead-Free Surface Finishes; Minimal Clear Residue-Compatible with LEDs; Passed Bono and Automotive SIR Tests

2. Description

AIM REL61 lead-free solder alloy is composed of tin, bismuth, silver, copper, and trace grain refining elements. REL61 has been proven to reduce tin whisker formation and exhibits superior thermal shock, vibration, and drop shock performance compared to SAC alloys. REL61 offers the electronics assembly market a low-cost alternative to SAC alloys, with reliability and performance equal to or better than SAC305 and other low-silver/silver-free solder alloys. REL61 has a lower melting point than all SAC alloys and silver-free alloys, and demonstrates excellent spreadability, flow, and wettability in production testing.