ERSA Reflow Soldering HOTFLOW 3/20 Product Introduction:

1. Since its introduction nearly 30 years ago, ERSA's reflow soldering ovens have set the industry standard for high-end reflow ovens. The new third-generation reflow oven, HOTFLOW 3, has been developed based on ERSA's patented multi-point nozzle heating technology. The developers of the new HOTFLOW series focused on enhancing the thermal transfer performance of the equipment and introduced a comprehensive set of improvements, including a redesigned process channel, increased production capacity with a revolutionary multi-track conveyor system, reduced electricity and nitrogen consumption, an improved cooling system, and optimized process control, among others.

2. This 10-zone reflow oven features an effective process length of over 5 meters, making it suitable for high-volume production needs.

3. In the history of reflow soldering technology, ERSA's HOTFLOW series employs the revolutionary ERSA Process Control (EPC) heat transfer process control system, which monitors not only the temperature of the air but also the air velocity. In this way, the system regularly monitors the actual heat transfer rate during the reflow process. The result is stable reflow technology, optimized process tunnel load, thermal mass, and machine runtime-independent heat exchange. EPC (patent pending) opens the door to a completely new level of improved reflow process control.

4. During the heating process in a reflow oven, heat is transferred to the PCB to bring all components and materials to the specified temperature process window. The actual temperature of the PCB during this process is the result of the heat transfer rate. Two factors affect heat transfer in a reflow oven: air temperature and air velocity. While closed-loop temperature control in reflow ovens is state-of-the-art, it only shows part of the picture—ERSA's EPC reveals the full picture.

German Ersa Hotflow 3/20e & 3/20 Reflow Soldering

A reflow soldering system for high-end users with high thermal performance and excellent energy balance.

Ersa reflow soldering leverages proven technologies such as multi-point nozzles, ultra-fine internal circulation conveyor systems, tested high-airtightness oven tunnels, and fully closed-loop oxygen content control to achieve high thermal efficiency, balanced heat distribution, extremely low conveyor vibration, and low N2 consumption, resulting in superior soldering processes and quality.

Ersa reflow soldering offers only two standard models for optimal soldering processes and quality:

1) Hotflow 3/20e (10-zone air oven)

2) Hotflow 3/20 (10-zone nitrogen oven)

III. ERSA Reflow Soldering HOTFLOW 3/20 Optional Accessories:

1. Nitrogen supply and control system with analyzer 2. Bottom active cooling 3. Temperature control and switching internal/external active cooling 4. Dual flux management with maintenance "flying" 5. Mass PCB center support 6. Multi-track conveyor system 7. ERSA process control software module 8. ERSA AutoProfiler software module 9. 17" touch screen 10. ERSA sensor shuttle temperature measurement system