Shenzhen Hengxin Hengye Technology Co., Ltd. was established in 2010 and is located in the high-tech frontier coastal city of Shenzhen. It is a high-tech enterprise specializing in the design and production of FPC flexible circuit boards (including single/double-layer boards, capacitive boards, module boards, side key button boards, and various types of FPC flexible circuit boards such as wiring harnesses) and FPCB rigid-flex boards. Since its inception, the company has continuously introduced production equipment and technology from domestic and international regions, dedicated to developing and producing precision and highly reliable flexible circuit boards (FPC). The circuit boards produced by the company are widely used in computer communications, microelectronics, automation control, medical instruments, high-precision testing and measurement equipment control boards, LCD screens for mobile phones, gaming devices, LED lighting, and the digital industry. The product quality complies with international IPC-A-600G (CLASS2) standards and RoHS environmental protection standards. The products are sold in cities across the country and international markets.

Ultra-thin flexible circuit boards (FPC) provide revolutionary structural solutions for smart devices. With a precision circuit layer thickness of only 0.1mm and polyimide substrate, they maintain strength while reducing weight by 60% compared to traditional PCBs, freeing up critical space for wearable devices and foldable screen smartphones. Utilizing high-density wiring technology, they achieve 10μm line width/spacing precision, improving signal transmission efficiency by 35%, and supporting 5G high-frequency and high-speed data transmission requirements. After 200,000 dynamic bending tests, they maintain stable conductivity and withstand extreme environments from -40°C to 150°C, adapting to the complex structural layouts of smart terminals. By incorporating environmentally friendly cover films and lead-free processes, they meet international safety certifications for demanding applications such as medical and automotive scenarios. Driving the continuous evolution of smart hardware through spatial reconfiguration and performance enhancement.