DOWSILTC-5888:

DOWSIL TC-5888 Overview:

Gray, thixotropic, non-curing thermal compound. The thermal compound is designed to provide effective heat transfer for cooling modules (including computer MPUs and GPUs). Product Details

DOWSIL TC-5888 is a new type of environmentally friendly thermal grease, single-component, medium viscosity, low volatile organic compound content, solvent-free, elastomeric silicone resin, wear-resistant, curable at room temperature or accelerated by heating. It offers high thermal conductivity and low holding costs for high-end microprocessor packaging.

DOWSIL TC-5888 grease is a new thermal compound developed specifically for servers. It is formulated with thermally conductive filler particles and optimized silicone polymers, achieving an overall thermal conductivity of up to 5.2 W/mK. It can also achieve an interface thickness as thin as 20 microns, resulting in low thermal resistance (0.05°C·cm2/W), enabling efficient heat dissipation.

Additionally, this thermal grease features unique rheological properties that restrict its flow within the target interface during assembly.

Advantages

Single-component material: No curing is required during application.

Staying capability: Functional rheological characteristics limit flow beyond the target interface once assembled. This flow characteristic distinguishes it from low-viscosity thermal compounds. When dispensing the compound between surface interfaces, it offers greater control for applications requiring thicker thermal compound layers or higher precision.

Thermal stability: Provides consistent performance and reliability at high temperatures.

Good processability: Compared to competitive thermal compounds, it offers low volatile content, allowing for more consistent rheology, application repeatability, and easier overall screen printing.

Additionally, this thermal grease has unique flow properties that restrict its flow within the target interface during assembly.

DOWSIL (formerly Dow Corning) TC-5888 grease is a high-performance new thermal compound developed for servers. It is formulated with thermally conductive filler particles and optimized silicone polymers, and can be used to improve the performance, reliability, and assembly efficiency of high-end electronic systems, including: computer microprocessors (MPUs), servers for cloud computing, data networking, and telecommunications infrastructure, as well as graphics processing units (GPUs) for gaming consoles, autonomous vehicles, and artificial intelligence.

After running-in, DOWSIL TC-5888 achieves a thermal conductivity of 5.2 W/mK. It is truly insulating and non-conductive, with stable performance that will not cause any damage to chips.