High solid content dual-cure photoresist is formulated by combining the advantages of diazo and photopolymer, suitable for solder paste in printed circuit boards, peelable solder masks, and direct ceramic printing. Pollution-free and harmless to the human body, it is ideal for long-term use. This blue-colored photoresist features a high solid content of 43%, high resolution, excellent edge definition, exceptionally fast photosensitivity, and strong adhesion as its outstanding characteristics. It is resistant to solvents and water, offers high resolution, good wear resistance, and easy exposure.