Chemical MechanicalCMPPolishingCooling Water Temperature Reduction Equipment

Product Introduction

1. In the field of semiconductor chip manufacturing, the surface treatment process of silicon wafers requires a flat surface during exposure to effectively avoid light scattering and achieve image transfer. The chemical mechanical polishing (CMP) method meets standard process requirements. As semiconductor chip manufacturing processes advance to the millimeter level, CMP is necessary to achieve the required surface flatness of silicon wafers.

2. Friction generated during the relative motion between the silicon wafer and the polishing pad causes the temperature of the polishing pad to rise, potentially reaching 80°C. The optimal temperature range for the polishing pad is 30°C to 75°C. Temperatures below 30°C or above 75°C can degrade the chemical reaction characteristics between the polishing slurry and the silicon wafer surface, affecting surface flatness. Therefore, a chemical mechanical CMP polishing cooling water temperature reduction equipment is required to control the water temperature.

3. The chemical mechanical CMP polishing cooling water temperature reduction equipment provides low-temperature chilled water to cool the cooling device of the polishing belt in the CMP polishing machine, addressing the issue of high polishing belt temperatures during operation. The cooling system includes a chilled water tank and a water pump, with the chilled water tank in contact with the polishing working surface of the belt, effectively reducing the temperature of the polishing belt during operation.

Equipment Application

The cooling of the built-in cooling device in double-sided chemical mechanical CMP polishing of silicon wafers utilizes the cold source provided by the chemical mechanical CMP polishing cooling water temperature reduction equipment. The regulation system and display control system allow real-time monitoring of the working temperature via the display panel. Chilled water flows through the cooling channels to cool the lower grinding disc, effectively controlling the processing temperature of the silicon wafer, improving the surface quality of CMP polishing, and reducing the silicon wafer breakage rate.

Product Advantages

As a temperature control system for chemical mechanical CMP polishing, the cooling water temperature reduction equipment controls the polishing temperature, ensuring the silicon wafer temperature remains within ideal parameters during polishing. This maintains high yield rates, extends the service life of the polishing process, and effectively enhances the flatness and stability of silicon wafers.

Product Features

Standard Type: Intelligent water temperature control from 5°C to 30°C ±1°C.

Custom Non-Standard Type: Intelligent water temperature control from -50°C to 85°C ±0.3°C; water flow control from 1 to 1000L ±0.03L; pressure control from 0.1 to 10 ±0.04Mpa.

Intelligent Control System: PLC, touch screen, data acquisition, RS485 interface, optional CAN communication bus, Ethernet interface for remote control, connectable to upper computer and mobile APP control.

Protection Functions: Power phase sequence protection, leakage protection, compressor overload protection, coil overheating protection, high and low pressure protection, water shortage protection, chilled water flow protection, anti-freezing protection.

After-Sales Service

To build our brand and establish a strong corporate image, we adhere to the principle of "pursuing quality in all aspects, with customer satisfaction as our goal." Based on the principles of "competitive prices, comprehensive service, and reliable product quality," we make the following solemn commitments:

1. The buyer's user department can receive free equipment operation training at our company.

2. Three months after use, our customer service department will conduct a follow-up on the equipment's usage status.

3. All our equipment comes with a one-year free warranty. During the warranty period, all required spare parts and repairs are covered by our company. However, damage due to improper use is not covered under warranty, and the buyer shall bear the costs of replacement parts, travel, and accommodation.

4. Based on consumer requirements, we provide free on-site debugging and technical guidance on usage.

5. Beyond the free warranty period, the buyer shall pay for replacement parts (priced at material procurement cost) in case of equipment damage.

6. We ensure the supply of equipment spare parts and offer lifetime maintenance service agreements, providing lifelong product maintenance services.

7. Upon receiving customer calls or "equipment failure notices," we will attempt remote maintenance. If unresolved, we will arrive on-site within 24 hours for locations within Guangdong Province and within 72 hours for locations outside Guangdong Province.

Technical Parameters