| ■METAL OXIDE FILM RESISTOR Metal Oxide Film Fixed Resistor |
■Stability Grade | 5%, 1% |
■Wide Range of Resistance Values, | 0.1 Ohm --- 22M Ohm |
■Packaging, | Available in bulk. Taping (26MM, 52MM). Forming and lead trimming |
Shenzhen Huaxin Ou Electronics Co., Ltd. Metal Oxide Film Resistor Series Specification Sheet |
★ Applicable Standards:
▲ GB/T5729 (IEC115-1) Fixed Resistors for Electronic Equipment, Part 1: General Specification. Japanese JIS Standard
▲ Q/RU270-2003 (Enterprise Standard) Metal Oxide Film Resistor Detailed Specification Assessment Level E |
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Structure: 1. Ceramic Core. 2. Metal Oxide Film 3. End Cap 4. High Insulation and Solvent-Resistant Epoxy Resin 5. Lead Wire with Good Solderability. ★ Outline Dimensions: |
Model | Resistor Body Size
(max) | Lead Dimensions | D±1 | L±1 | d±0.05 | l±1 | 1/8W(1/6W)1/4WS | 1.5 | 3.2 | 0.40 | 26 | 1/4W 1/2WS | 2.3 | 6.2 | 0.60 | 26 | 1/2W 1WS | 2.8 | 8.5 | 0.60 | 26 | 1W 2WS | 3.8 | 10.5 | 0.60 | 26 | 2W 3WS | 4.5 | 14.5 | 0.65 | 26 | 3W 5WS | 5.5 | 16.5 | 0.70 | 26 | 5W 7WS | 8.5 | 25 | 0.75 | 34 |
Shenzhen Huaxin Ou Electronics Co., Ltd. Specification Sheet
2-1 ★ Main Technical Indicators: ■METAL OXIDE FILM RESISTOR Metal Oxide Film Fixed Resistor |
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Model | Rated Power
(W) | Resistance Range
(Ω) | Resistance Tolerance
±(%) | Temperature Coefficient of Resistance
±(×10-6/℃) | Component Limit Voltage
(V) | Insulation Voltage
(DC or AC Peak)
(V) | 1/4W 1/2WS | 0.25 | 0.1—22M | 5(J), 1(F)
| 350 | 300 | 500 |
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1/2W 1WS | 0.5 | 0.1—22M | 5(J), 1(F)
| 350 | 350 | 500 | 1W 2WS | 1.0 | 0.1—22M | 5(J), 1(F)
| 350 | 500 | 500 | 2W 3WS | 2.0 | 0.1—22M | 5(J), 1(F)
| 350 | 750 | 500 | 3W 5WS | 3.0 | 0.1—22M | 5(J), 1(F)
| 350 | 800 | 500 | 5W 7WS | 5.0 | 0.1—22M | 5(J), 1(F)
| 350 | 800 | 500 |
★ Main Inspection Items, Inspection Methods, and Performance Requirements |
Inspection Item | Performance Requirement | Inspection Method | Temperature Coefficient of Resistance | ±350×10-6/℃ | -55℃ to +155℃ | Room Temperature Endurance | ±（1%R+0.1Ω） | VR(or Umax) 1000h | Withstand Voltage | No breakdown or flashover | V-block method, apply AC voltage with peak value of 1.42 times the insulation voltage value, t=1min | Solderability | Free flow of solder and wetting of leads indicate good solderability | Tank temperature: 235±5℃ Immersion time: 2±5s | Overload | ±（2%R+0.05Ω） | Apply 2.5VR(or Umax) Duration: 5S | Lead Strength | ±（0.5%R+0.05Ω） | Pull force: <0.5W:10N; 1W-3W:22.2N
Bending: 2 times
Twist: 180° 2 times | Resistance to Soldering Heat | ±（0.5%R+0.05Ω） | Tank temperature: 350±10℃ Immersion time: 3.5±5S | Rapid Temperature Change | ±（2%R+0.05Ω） | -55℃/+125℃ 5 cycles | Vibration | ±（0.5%R+0.05Ω） | Frequency: 10Hz to 500Hz Amplitude: 0.75mm or 98m/s2(whichever is smaller)
Total duration: 6h | Climatic Sequence | ±（2%R+0.1Ω） | Dry heat Cyclic damp heat (first cycle) Cold
Low pressure Cyclic damp heat (remaining cycles) DC load | Steady State Damp Heat | ±（2%R+0.1Ω） | V=0.1√PR T=40±2℃ Relative humidity (90 to 95)% Time: 56 days | Upper Category Temperature Endurance | ±（2%R+0.1Ω） | V=0 T=155℃ Time: 1000h | Discharge Test | ±20% | <0.5W:1mΩ to 68mΩ, 1W-3W:100KΩ to 68mΩ
According to UL1676 Section 6.3. Apply U=10KV, Capacitance Cd=0.001μf, Pulse period T=5 seconds, total 50 times |
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