SuperViewW1Optical Surface ProfilerMeasurement Results Include:

1. 3D Surface Structure: Roughness, waviness, surface structure, defect analysis, grain analysis, etc.;

2. 2D Image Analysis: Distance, radius, slope, grid map, contour lines, etc.;

3. Surface and Interface Measurement: Transparent surface topography, film thickness, surfaces beneath transparent films;

4. Step Height Measurement for Thin and Thick Films;

5. Scratch Morphology, Quantitative Measurement of Friction Wear Depth, Width, and Volume;

6. Microelectronic Surface Analysis and MEMS Characterization.

SuperViewW1Optical Surface Profiler is based on white light interferometry technology, capable of testing various surfaces with resolution better than nanometer level, automatically focusing on workpieces to obtain over 100 parameters including 2D and 3D surface roughness and profiles. It is widely used in optics, semiconductors, materials, precision machinery, and other fields. It is an optical measuring instrument for non-contact measurement of sample surface topography. In addition to measuring surface topography or surface profiles, the SuperViewW13D White Light Optical Profiler also features wafer warpage measurement, making it highly suitable for warpage measurement, strain measurement, and surface topography measurement of wafers, solar cells, and glass panels. Its technical competitiveness lies in the combination of contact and optical 3D profilers. By leveraging the advantages of both contact and non-contact dual modes, it obtains comprehensive surface characteristics. It can be used for both scientific research and industrial product inspection.

Main Application Areas:

1. For solar cell measurement;

2. For semiconductor wafer measurement;

3. For flatness measurement of coated glass;

4. For metrology of mechanical components;

5. For measurement of plastic, metal, and other composite material workpieces.