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China Hefei Ceramic Capillary, Nanchang Ceramic Nozzle, Shenzhen IC Packaging Ceramic Capillary - China Supplier
China Hefei Ceramic Capillary, Nanchang Ceramic Nozzle, Shenzhen IC Packaging Ceramic Capillary - China Supplier China Hefei Ceramic Capillary, Nanchang Ceramic Nozzle, Shenzhen IC Packaging Ceramic Capillary - China Supplier China Hefei Ceramic Capillary, Nanchang Ceramic Nozzle, Shenzhen IC Packaging Ceramic Capillary - China Supplier China Hefei Ceramic Capillary, Nanchang Ceramic Nozzle, Shenzhen IC Packaging Ceramic Capillary - China Supplier China Hefei Ceramic Capillary, Nanchang Ceramic Nozzle, Shenzhen IC Packaging Ceramic Capillary - China Supplier

Hefei Ceramic Capillary, Nanchang Ceramic Nozzle, Shenzhen IC Packaging Ceramic Capillary

Price:¥32
Industry Category: Electronic Components
Product Category:
Brand: 蘇森源
Spec: 定做


Contact Info
  • Add:東莞寮步鎮(zhèn)富竹山工業(yè)區(qū)d, Zip: 523000
  • Contact: 李星
  • Tel:15015379097
  • Email:49602247@qq.com

Other Products

Description
Additional Information

Our company offers a complete range of ceramic capillary models, fully capable of replacing imported ceramic capillaries. Stable quality. Welcome to inquire and cooperate. We maintain ready stock, support custom shapes, and ensure timely delivery.



Our company is located in Dongguan, Guangdong and Suzhou, Jiangsu, specializing in the production of ceramic capillaries, which can be used for chip packaging of various aperture sizes. Fully

replace imports. High cost-effectiveness. Welcome to inquire.
Ceramic capillaries (ceramic nozzles) are widely used in semiconductor IC packaging and LED packaging, serving as key core tools in the packaging process. Ceramic capillaries are used as

bonding tools in the wire bonding process and can be applied to the bonding and packaging of circuits such as thyristors, surface acoustic wave devices, LEDs, diodes, transistors, and IC chips. The main products provide electrical connections between chips and external systems, offer a stable and reliable working environment for chips, provide mechanical and environmental protection for integrated circuit chips,

and ensure heat dissipation pathways to maintain normal chip operation. In semiconductor processes, packaging is one of the most critical steps, and "wire bonding" is the primary method used to achieve circuit connections between chips and substrates. In this process, one tool is indispensable:

ceramic capillaries. Welcome to inquire and support cooperation.

Industry Category Electronic Components
Product Category
Brand: 蘇森源
Spec: 定做
Stock: 100000
Manufacturer:
Origin: China / Guangdong / Dongshi
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