CECJC Technology TR-50S IC Lead Straightening Machine

Introduction to IC Lead Straightening Machine:

The IC lead straightening machine places ICs with deformed leads into a specially designed chip positioning fixture slot.

It then aligns with high-precision straightening combs that match the lead pitch of SMT chips in various package forms. The device retrieves the stored lead straightening process parameter program from the computer,

and driven by the machine's robotic arm, performs high-precision X/Y/Z-axis straightening to correct the deformed leads of the IC in the slot—adjusting left/right (pitch) and up/down (coplanarity). After one side

is completed, the operator uses a suction pen to flip the IC to the other side for automatic repair, repeating until all sides are straightened.

Technical Parameters of IC Lead Straightening Machine:

1. Changeover time: 5-6 mins

2. Types of straightening combs: 0.4mm, 0.5mm, 0.635mm, 0.65mm, 0.8mm, 1.0mm, 1.27mm, 2.54mm

(Select comb based on lead pitch)

3. Chip positioning fixture size: Positioning tolerance ≤0.05mm (Select fixture based on chip type)

4. Applicable chip types: QFP, LQFP, RQFP, TQFP, QSOP, TSSOP, TSOP, SSOP, SOP, SOIC, SO,

SOL, DL, PGA, and other IC package forms

5. Chip body size range: 5mm×5mm—50mm×50mm

6. Lead pitch range: 0.4mm—2.54mm

7. Lead straightening deviation range: ≤±26.7% of lead width

8. Straightening precision: ±0.03mm

9. Coplanarity of straightened IC leads: ≤ 0.1mm

10. Power supply: 100-240V AC, 50/60Hz

11. Electron microscope field of view and magnification: 60*60mm, 1-60x

12. Equipment dimensions: 760mm(L) ×700mm(W) ×760mm(H)

13. Operating temperature: 25°C ±10°C, suitable for lab and field environments

14. Humidity: 20%--60%

Performance Features of IC Lead Straightening Machine:

1. Capable of straightening and repairing leads for chips in package forms such as QFP, LQFP, RQFP, TQFP, QSOP, TSSOP, TSOP, SSOP,

SO, SOP, SOIC, SOL, DL (SSOP), etc.

2. Manual placement of IC into chip positioning fixture, with elastic mechanism to automatically secure the chip, preventing movement that could cause straightening failure and avoiding damage to the chip.

3. Automatically performs left/right (pitch) and up/down (coplanarity) straightening and repair on IC leads, with no manual adjustment required.

4. Pre-stored straightening programs in the computer correspond to various chip types. Parameters can be pre-programmed based on user-provided chip samples.

5. Devices with the same lead pitch can use the same straightening comb without change. ICs with the same body size can use the same positioning fixture without replacement.

6. Quick changeover of chip positioning fixtures and straightening combs enables fast product switching, suitable for high-mix batch production.

7. Specially designed inclined-tooth straightening combs insert from the lead root to the device, improving alignment efficiency and reliability, and reducing pre-straightening requirements for IC leads.

8. Comprehensive system protection functions, including multiple warning signals, emergency stop, and automatic alarm.

9. Modular structure design for easy expansion, upgrade, and maintenance.

10. Straightening and repair monitored under an electron microscope to reduce eye strain.

11. Equipped with anti-static function to ensure electrostatic safety of the straightened devices.