Small Desktop Magnetron Sputtering Coating Machine Equipment Purpose: Used for the preparation of novel thin film materials such as nanoscale single-layer and multilayer functional films, hard films, metal films, semiconductor films, and dielectric films. It can be widely applied in scientific research and small-batch preparation of thin film materials in universities and research institutes. Equipment Composition The system mainly consists of a sputtering vacuum chamber, permanent magnet magnetron sputtering targets (3 targets), single-substrate heating stage, DC power supply, RF power supply, working gas path, pumping system, vacuum measurement, electrical control system, and installation platform. Technical Specifications: 1. Ultimate vacuum: 6.7×10?? Pa; Vacuum reaches 4×10?? Pa after 1 hour at full speed of the molecular pump; 2. Ultra-high vacuum magnetron targets: Effective size 3 inches, quantity: 3 pieces, permanent magnet targets (with side-opening shutters), water-cooled; 3. Target-to-substrate distance adjustable from 120-200 mm, guided by optical axis and linear bearings, manually continuously adjustable with scale indication; three targets for co-sputtering, targets can be tilted at angles from 0 to 45°; 4. Sample heating: Uses iodine-tungsten lamp heating method to heat the sample, sample can be heated up to 400°C; 5. Effective sample size for magnetron sputtering: Φ60 mm, only one piece coated at a time; during coating, the sample holder rotates, rotation speed 0-50 rpm; sample negative bias voltage adjustable from 0-200 V; 6. Gas control: Gas flow controlled by two mass flow controllers, flow range: 0-50 sccm; 7. The system has manual control functions, mainly for sample heating control; sample rotation control; magnetron target shutter control; vacuum level acquisition.