Features of the XTM-105-F Series Hot Press Blister Machine:

1. This series of hydraulic machines uses liquid pressure from 1-14 MPA as the power source, with an external three-phase AC380V 50HZ or three-phase AC220V 60HZ power supply. The maximum total power consumption does not exceed 8.5 KW.

2. It adopts a four-column three-plate structure, ensuring high parallel accuracy between the movable plate and the work surface. Four precision guide sleeves ensure high vertical accuracy during pressing.

3. The cylinder is adjustable, with high accuracy in bottom dead center positioning and a repeat accuracy of 0.01 mm.

4. The hydraulic unit is integrated inside the frame, offering a compact structure and an aesthetically pleasing appearance.

5. Casters and leveling feet are installed under the worktable for easy mobility and efficient operation. The weight of this series does not exceed 450 KG.

6. The work surface is equipped with a heat-treated heating plate and an intelligent temperature controller, allowing separate control of upper and lower mold temperatures for convenient operation.

7. An optional middle template with a force sensor and display can be added to accurately show the force applied to the product.

8. An electronic scale or grating scale with a display can also be added to accurately show the displacement of the cylinder.

9. Customers can adjust the pressing stroke, pressure holding time, and closing height for easy operation.

10. The hydraulic output range of this series includes options from 3 tf, 5 tf, 10 tf, up to 50 tf (1 tf = 1000 kgf = 9.8 KN), and can also be customized according to customer requirements.

11. (Note: Specifications and parameters can also be customized based on customer needs.)

Applications of the Hot Press Machine:

1. Punching and cutting of silicone or plastic buttons for mobile phones or remote controls, and trimming or slicing of plastic products.

2. Precision cutting of protective films for mobile phones, digital cameras, and laptop LCD screens, as well as various labels and trademarks.

3. Embossing, blistering, and forming of membrane switches and panels made of PV, PE, PC, and other films.

4. Pressing and forming of flexible circuit lines for laptop keyboards, etc.