NanoSilver Powder Flake Silver PowderUltrafine SphericalSilver Powder Conductive Silver Powder Submicron Silver Powder Ag  silver atom

HS Code: 71069110

CAS: 7440-22-4         

Technical Parameters:

ProductFeatures:

Silver powder has low bulk density and good fluidity; the conductive layer of silver powder has a smooth surface and excellent conductivity; it is a high-performance conductive filler material with good oxidation resistance; the surface effect and quantum size effect of nano-silver particles also give them special applications, such as surface-enhanced Raman applications and medical applications; research shows that the smaller the silver particle size, the stronger the antibacterial performance.

Potential Application Areas:

1. Thin films, ultrafine fibers;

2. Plastic substrates such as ABS and PVC;

3. Antibacterial pharmaceuticals and medical devices, antibacterial plastics and rubber products, antibacterial textiles and clothing/footwear, antibacterial coatings, ceramics and glass, green antibacterial coatings;

4. Used in high-temperature sintered conductive silver paste and low-temperature polymer conductive silver paste;

5. Mainly used as conductive filler for high-temperature sintered conductor pastes. Different sintering targets can be achieved by combining this series of silver powders. It can also be used for special purposes such as catalysts and antibacterial materials; also used as conductive filler in conductive coatings, conductive inks, and polymer conductive silver pastes; it is a high-performance conductive filler material with good oxidation resistance. Widely used in electronic pastes, conductivity in electronic products, and antibacterial/antiviral applications.

Packaging and Storage

This product is default vacuum-sealed in multi-layer bags, with additional paper drums/cartons. After receipt, it should be stored sealed in a dry, cool environment. Prolonged exposure to air should be avoided to prevent moisture-induced agglomeration, which may affect dispersion performance and usage effectiveness.