Indium3.2HF is a water-washable solder paste that can be reflowed in both air and nitrogen atmospheres, specifically designed to meet the needs of the electronics industry's commonly used, higher process temperature

SnAgCu, SnAg, SnSb, and other lead-free alloy systems. The formulation of Indium3.2HF ensures stable printing performance, extended
working life, and sufficient tackiness, thereby helping to address the challenges of today's high-speed and high-mix surface mount production lines. In addition to the above
advantages, Indium3.2HF exhibits excellent wetting performance on various lead-free surfaces and achieves very low voiding rates on fine-pitch components (including BGAs and CSPs).