Indium10.1 is a no-clean solder paste that can be reflowed with air or nitrogen, specifically designed to meet the needs of alloy systems with higher process temperatures commonly used in the electronics industry, while also being suitable for other alloy systems that can replace traditional lead-containing solders. Indium10.1 offers excellent stencil transfer efficiency and can be used under various process conditions. Additionally, its high oxidation resistance essentially eliminates incomplete coalescence of small deposits (graping) and pillow defects. It is one of Indium Corporation's solder paste products with the lowest voiding rate. Indium10.1 also provides the lowest voiding rate on large planar surfaces for components.

Features
Low voiding rate for components
? Excellent resistance to pillow defects
? High print transfer efficiency for small apertures
? Elimination of graping phenomenon
? Superior wetting performance on metallized surfaces of RF components