HYDRON? SE 230A
Alkaline cleaning agent for semiconductor devices

A single-phase water-based cleaning agent specifically designed for immersion cleaning processes, effectively removes flux residues after chip soldering of various semiconductor electronic devices, including lead frames, discrete devices, power modules, power LEDs, flip chips, and CMOS, while ensuring effective removal of oxide layers on copper surfaces.

Advantages compared to other cleaning solutions:

Provides a stain-free and activated copper surface for subsequent processes such as wire bonding, packaging, and adhesive bonding, maintaining activity for a certain period
Exhibits excellent material compatibility when handling sensitive metal materials like copper, aluminum, and nickel
Very low surface tension, enabling effective removal of residues at the bottom of low-gap components
Simple application process in immersion cleaning
Easily rinsed off with deionized water without leaving any residues
Application Areas
Contaminant Removal
Cleaning Processes
Cleaning Techniques
SiP Packaging Cleaning
Wafer-Level Packaging Cleaning
MEMS Device Packaging Cleaning
Camera Module Cleaning
Power Electronic Device Cleaning