Core Application Areas and Typical Scenarios

1. Semiconductor Photoresists

ArF Photoresist: As a matrix resin monomer, it is combined with γ-butyrolactone methacrylate (GBLMA) and 3-hydroxy-1-adamantyl acrylate (HADA) to prepare high-sensitivity photoresists with a resolution of 120 nm. Its adamantane structure regulates the dissolution rate through acidolysis; after exposure to 193 nm laser, the development contrast reaches 3.8, meeting the requirements of advanced processes.

Negative Photoresist: After forming an inclusion complex with cyclodextrin, it can construct a supramolecular crosslinking network that maintains colloid softness even in a -30°C freezing environment. It is used for automatic labeling of refrigerated blood bags, solving the problem of traditional acrylate adhesives becoming brittle at low temperatures.

2. Optical Materials

High Refractive Index Coating: Combined with isosorbide diacrylate, it can prepare a transparent resin with a refractive index of 1.58, used for smartphone camera lenses. Its light transmittance (88%) and scratch resistance hardness (4H) are superior to commercially available PMMA materials.

UV-curing Lens: Adding 5-10% MAA to the UV curing system can improve the uniformity of the lens refractive index to Δn<±0.0005, making it suitable for micro-nano optical elements in AR/VR devices.

3. High-performance Adhesives

Extreme Environment Resistant Adhesive: Copolymerized with polyurethane acrylate, it can prepare a structural adhesive resistant to temperature cycles from -50°C to 180°C. It is used for bonding aircraft engine components, and its shear strength (22 MPa) and fatigue life (10? cycles) far exceed traditional epoxy adhesives.

Biodegradable Pressure-sensitive Adhesive: Combined with polylactic acid block polymers, it can prepare eco-friendly tape that completely degrades within 30 minutes after contact with water, solving the application limitations of traditional acrylate adhesives in open-air operations.

4. Smart Responsive Materials

Temperature-sensitive Hydrogel: Copolymerized with N-isopropylacrylamide, it can construct a smart hydrogel with an LCST (Lower Critical Solution Temperature) of 32°C, used in drug sustained-release systems. Its swelling ratio (500%) and mechanical strength (264 kPa) are superior to ordinary PNIPAM gels.

Photo-responsive Polymer: By introducing MAA via radical polymerization, a photoresist that undergoes volume shrinkage (shrinkage rate 12%) under 365 nm light irradiation can be prepared, used for precision molding of Micro-Electro-Mechanical Systems (MEMS).