Factory Transfer 13B/15B/16B/28B/30B/40 Double-Sided Polishing Machine, Surface Grinding Machine with Training and Debugging Included

This machine is primarily used for double-sided grinding of silicon wafers, gallium arsenide wafers, ceramic sheets, quartz crystals, glass, and other hard and brittle materials. The machine has been optimally designed in terms of structure, precision, functionality, reliability, and manufacturability, offering excellent performance that fully meets user requirements.

Sales Technology Manager Yang: 181-030-45976

I. Overview

1.1 The machine adopts a gantry structure, with an aesthetically pleasing and generous appearance, enhancing overall rigidity.

1.2 The entire machine is driven by a single motor. After passing through a reducer, four sets of gears with different speed ratios provide varying speeds to the upper grinding plate, lower grinding plate, ring gear, and sun gear, achieving the optimal speed ratio to meet process requirements. The speed ratio of the sun gear relative to the other three speeds is adjustable (two levels), allowing the carrier to rotate forward or reverse, meeting the needs of different grinding (plate conditioning) processes.

1.3 The machine features a lower grinding plate lifting mechanism, allowing the lower grinding plate to stop and self-lock at any position within the full stroke range to meet the need for adjusting the engagement height of the carrier.

1.4 The machine inherits the successful experience of pressure control from other grinding machines: it adopts a four-stage pressure process, namely light pressure, medium pressure, heavy pressure, and conditioning (light pressure).

1.5 The machine uses a PLC and a four-line text display, with variable frequency speed regulation. The motor speed can be manually adjusted at any time via an external potentiometer. The speed automatically changes based on preset four-stage speeds and corresponding run times, with the four-stage speed run times corresponding to the four-stage pressure times. The equipment is equipped with an interface for workpiece thickness measurement devices.

1.6 The design of the liquid collection basin and guard ring adopts a semi-exposed structure, ensuring no sand leakage during operation and facilitating user cleaning.

1.7 The grinding speed matching conforms to the internationally accepted grinding mechanism, and this speed matching has been widely recognized (181-030-45976).

III. Main Technical Parameters

1. Grinding Plate Dimensions (mm): φ1118×φ386×50

2. Carrier Parameters: Imperial: Number of Teeth Z = 200, DP = 12, α = 20°; Metric: Number of Teeth Z = 142, m = 3, α = 20°

3. Number of Carriers: 5 pieces

4. Number of Conditioning Wheels: 4 pieces

5. Minimum Grinding Thickness: 0.50mm/φ125, 0.40mm/φ100, 0.35mm/φ75

6. Grinding Thickness: 30mm

7. Grinding Diameter and Number of Pieces: φ75/17 pieces, φ100/8 pieces, φ125/5 pieces

8. Grinding Diameter: φ350mm

9. Lower Grinding Plate Speed: 0–60 rpm

10. Main Motor: 11 kW, 380 V, 1460 rpm

11. Three-Phase Electric Pump: AB-100, 250 W, 100 L/min

IV. Precision Indicators

1. Lower Grinding Plate Face Runout: 0.08

2. Flatness of Upper and Lower Grinding Plates: 0.030 (only lower plate inspected)

3. Sun Gear Radial Runout: 0.12

4. Ring Gear Radial Runout: 0.20

5. Non-Coincidence of Rotation Centers of Upper and Lower Grinding Plates: ≤0.5 mm

Precision Status of Four Conditioning Wheels:

6. Thickness Consistency: 0.008