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China Nano-silica polishing slurry for silicon wafer glass polishing - China Supplier
China Nano-silica polishing slurry for silicon wafer glass polishing - China Supplier

Nano-silica polishing slurry for silicon wafer glass polishing

Price:Negotiable
Industry Category: Hardware & Tools/Electric Cutting Tools/Drill Bit
Product Category:
Brand: 晶和
Spec: VK-SP30W/50W


Contact Info
  • Add:廣州市白云區(qū), Zip:
  • Contact: 甘以球
  • Tel:18620162670
  • Email:

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Description
Additional Information

Silicon WaferGlass PolishingNano Silica Polishing Slurry

Jingrui New Material Co., Ltd.Mr. Gan18620162680.WeChat

Nano silica abrasive polishing slurry is composed of high-purity nano silica and other composite materials. It is dispersed into nanoparticles through high-tech methods, resulting in a uniformly dispersed nano polishing slurry with characteristics such as high strength, high adhesion, excellent film-forming ability, high permeability, high weather resistance, and high wear resistance. It is an excellent polishing material for CMP technology.CM Ptechnology polishing material.

Technical Specifications:

Nano Silica Polishing SlurryVK-SP30WWhite Emulsion30nm 20-30%Content Water

Nano Silica Polishing SlurryVK-SP50WWhite Emulsion50nm 20-30%Content Water

Application Characteristics of Nano Silica Abrasive Polishing Slurry:

1、Fast and flat polishing processing. This product utilizes uniform nanoparticles of materials such as SiO2, which do not cause physical damage to the workpiece. It achieves high-speed polishing through the use of uniformly dispersed large-particle colloidal silica particles.

2、High purity. The polishing slurry does not corrode equipment and has high safety performance.

3、Achieves high-level flatness processing.

4、Effectively reduces surface scratches after polishing and lowers surface roughness.

Application Scope:

1、Can be used for surface polishing of glass-ceramics.

2、Used for rough and fine polishing of silicon wafers and IC processing, suitable for flatness processing of multilayer thin films in large-scale integrated circuits.

3、Used in the processing of semiconductor devices such as post-CMP cleaning of wafers, flat panel displays, polycrystalline modules, microelectromechanical systems, and photoconductive camera tubes.

4、Widely used in CMP chemical mechanical polishing, such as nano-level and sub-nano-level polishing of silicon wafers, compound crystals, precision optical devices, hard disk platters, gemstones, marble, etc.

5、This product can be used as an additive and is also applicable in fields such as water-based high-weather resistance stone protective fluids, water-based adhesives, and high-weather resistance exterior wall coatings.

Precautions for Using Nano Silica Abrasive Polishing Slurry:

1If a small amount of precipitation occurs after long-term storage, it is normal. Stir with a mixer until uniform, and it will not affect usage.

2、If the product thickens, which is a characteristic of silica itself, dilute it with water at a ratio of 1:1, stir until uniform, and then use.

3Store in a sealed container in a dry, cool place away from direct sunlight.

Packaging:20kg/drum

Industry Category Hardware & Tools/Electric Cutting Tools/Drill Bit
Product Category
Brand: 晶和
Spec: VK-SP30W/50W
Stock: 9999
Manufacturer:
Origin: China / Guangdong / Guangzhoushi
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